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Bibliographic Details
Format: Book
Language:English
Subjects:
Microelectronic packaging
Handbooks and manuals.
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MU Engineering Library - Temporarily stored offsite - Place Request

Holdings details from MU Engineering Library - Temporarily stored offsite - Place Request
Call Number: ENGR TK7874 .M485 1989
Copy 0 AVAILABLE
Notes:
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Missouri S&T 3rd Floor

Holdings details from Missouri S&T 3rd Floor
Call Number: TK7874 .M485 1989
Copy 1 AVAILABLE
Notes:
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