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Summary goes here

Guardat en:
Dades bibliogràfiques
Format: Llibre
Idioma:anglès
Matèries:
Microelectromechanical systems.
Microelectronic packaging.
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MU Engineering Library - Temporarily stored offsite - Place Request

Detall dels fons de MU Engineering Library - Temporarily stored offsite - Place Request
Signatura: ENGR TK7875 .A378 2010
Còpia 0 AVAILABLE
Notes:
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Missouri S&T 3rd Floor

Detall dels fons de Missouri S&T 3rd Floor
Signatura: TK7875 .A378 2010
Còpia 1 AVAILABLE
Notes:
  • json {"id":"ac6ea899-7196-5d37-a963-0b081690206e","status":{"code":"AVAILABLE"},"location":{"code":"R3RDM","name":"Missouri S&T 3rd Floor"},"barcode":"050-106850894","callNumber":"TK7875 .A378 2010","hostLmsCode":"UMSYS","sourceHostLmsCode":"UMSYS","owningContext":"UMSYS","isRequestable":true,"isSuppressed":false,"holdCount":0,"availabilityDate":"2026-05-18T02:57:33.196815873Z","localItemType":"Book","canonicalItemType":"CIRC","localItemTypeCode":"Book","agency":{"code":"6mrln","name":"University of Missouri Library System","description":"University of Missouri Library System"},"statusCorrectAsOf":"2026-05-18T02:57:33.695025356Z"}