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| Format: | Book |
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| Language: | English |
| Subjects: | |
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| era | |
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| format | Book |
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| id | d057c8da-b59c-453a-99c8-d086cd87756f |
| isbn | 9780071428293 (acid-free paper) |
| issn | |
| language | eng |
| physical | x, 260 pages :illustrations ;25 cm |
| publication | – publisher: McGrawHill dateOfPublication: ©2004 |
| publishDate | ©2004 |
| subjects | |
| title | Area array packaging processes : for BGA, Flip Chip, and CSP / Ken Gilleo, editor. |
| topic | Microelectronic packaging. Multichip modules (Microelectronics) |