Cover Image

Summary goes here

Saved in:
Bibliographic Details
Format: Book
Language:English
Subjects:
Microelectronic packaging.
Multichip modules (Microelectronics)
Tags: Add Tag
No Tags, Be the first to tag this record!

MU Engineering Library - Temporarily stored offsite - Place Request

Holdings details from MU Engineering Library - Temporarily stored offsite - Place Request
Call Number: ENGR TK7874 .A72 2004
Copy 0 AVAILABLE
Notes:
  • json {"id":"144b8460-7b9e-5190-afff-bd5464040c86","status":{"code":"AVAILABLE"},"location":{"code":"CNTSO","name":"MU Engineering Library - Temporarily stored offsite - Place Request"},"barcode":"010-506207347","callNumber":"ENGR TK7874 .A72 2004","sourceHostLmsCode":"UMSYS","isRequestable":true,"isSuppressed":false,"holdCount":0,"availabilityDate":"2026-05-18T02:55:29.531530534Z","localItemType":"Book","canonicalItemType":"UNKNOWN - NULL hostLmsCode","localItemTypeCode":"Book","statusCorrectAsOf":"2026-05-18T02:55:29.725543071Z"}