APA (7th ed.) Zitazioa

(2004). Area array packaging processes: For BGA, Flip Chip, and CSP / Ken Gilleo, editor.

Chicago Style (17th ed.) Zitazioa

Area Array Packaging Processes: For BGA, Flip Chip, and CSP / Ken Gilleo, Editor. 2004.

MLA (9th ed.) Zitazioa

Area Array Packaging Processes: For BGA, Flip Chip, and CSP / Ken Gilleo, Editor. 2004.

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