Cita APA (7th ed.)

(2004). Area array packaging processes: For BGA, Flip Chip, and CSP / Ken Gilleo, editor.

Cita Chicago (17th ed.)

Area Array Packaging Processes: For BGA, Flip Chip, and CSP / Ken Gilleo, Editor. 2004.

Cita MLA (9th ed.)

Area Array Packaging Processes: For BGA, Flip Chip, and CSP / Ken Gilleo, Editor. 2004.