APA (7e ed.) Bronvermelding

(2005). Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005: Presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA / sponsored by the Electronic and Photonic Packaging Division, ASME.

Chicago (17e ed.) Bronvermelding

Electronic and Photonic Packaging, Integration and Packaging of Micro/nano/electronic Systems--2005: Presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA / Sponsored by the Electronic and Photonic Packaging Division, ASME. 2005.

MLA (9e ed.) Bronvermelding

Electronic and Photonic Packaging, Integration and Packaging of Micro/nano/electronic Systems--2005: Presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA / Sponsored by the Electronic and Photonic Packaging Division, ASME. 2005.