(2005). Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005: Presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA / sponsored by the Electronic and Photonic Packaging Division, ASME.
توثيق أسلوب شيكاغو (الطبعة السابعة عشر)Electronic and Photonic Packaging, Integration and Packaging of Micro/nano/electronic Systems--2005: Presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA / Sponsored by the Electronic and Photonic Packaging Division, ASME. 2005.
توثيق جمعية اللغة المعاصرة MLA (الإصدار التاسع)Electronic and Photonic Packaging, Integration and Packaging of Micro/nano/electronic Systems--2005: Presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA / Sponsored by the Electronic and Photonic Packaging Division, ASME. 2005.