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Detalhes bibliográficos
Formato: Livro
Idioma:inglês
Assuntos:
Electronic packaging
Integrated circuits
Microelectromechanical systems
Microelectronic packaging
Nanotechnology
Photonics
Surface mount technology
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Missouri S&T 3rd Floor

Detalhes do Exemplar Missouri S&T 3rd Floor
Área/Cota: TK7870.15 .E422 2005
Cód. Barras: 0 AVAILABLE
Observações:
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