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Detalles Bibliográficos
Formato: Libro
Lenguaje:inglés
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Microelectronic packaging.
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MU Engineering Library - Temporarily stored offsite - Place Request

Detalle de Existencias desde MU Engineering Library - Temporarily stored offsite - Place Request
Número de Clasificación: ENGR TK7874 .A332 2006
Copia 0 AVAILABLE
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  • json {"id":"dbc80b42-88fa-5bb9-9251-4abefd6ba62f","status":{"code":"AVAILABLE"},"location":{"code":"CNTSO","name":"MU Engineering Library - Temporarily stored offsite - Place Request"},"barcode":"010-103744398","callNumber":"ENGR TK7874 .A332 2006","sourceHostLmsCode":"UMSYS","isRequestable":true,"isSuppressed":false,"holdCount":0,"availabilityDate":"2026-05-17T22:01:47.044927066Z","localItemType":"Book","canonicalItemType":"UNKNOWN - NULL hostLmsCode","localItemTypeCode":"Book","statusCorrectAsOf":"2026-05-17T22:01:47.524395828Z"}