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Bibliographic Details
Format: Book
Language:English
Subjects:
Electronic packaging
Multichip modules (Microelectronics)
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Missouri S&T 3rd Floor

Holdings details from Missouri S&T 3rd Floor
Call Number: TK7870.15 .E434 1994
Copy 0 AVAILABLE
Notes:
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MU Library Depository 1

Holdings details from MU Library Depository 1
Call Number: ENGR TK7870.15 .E434 1994
Copy 1 AVAILABLE
Notes:
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