(2018). Performance and reliability of bonded interfaces for high-temperature packaging / PI: Paul Paret.
Chicago-referens (17:e uppl.)Performance and Reliability of Bonded Interfaces for High-temperature Packaging / PI: Paul Paret. 2018.
MLA-referens (9:e uppl.)Performance and Reliability of Bonded Interfaces for High-temperature Packaging / PI: Paul Paret. 2018.
Varning: dessa hänvisningar är inte alltid fullständigt riktiga.